HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/HYSOL EO1061電子組裝/工業膠水/電子組裝膠水/工業用膠
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EO1061 is designed to pass 1,000 hours of temperature/humidity/bias testing and thermal cycling up to125°C. Exceptional viscosity stability at 25°C provides easier control of shot size using conventional time/pressure dispensing equipment.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield - RVF, 25 °C, mPa•s (cap):Spindle 6, speed 2 rpm 50,000Spindle 6, speed 20 rpm 32,500Specific Gravity @ 25 °C 1.78Pot life @ 25 °C, , 200 grams mass, days 25Gel Time @ 121oC, minutes 13Shelf Life:@ 4oC, months 7@ -40oC, months 12Flash Point - See MSDSTYPICAL CURING PERFORMANCE Recommended Cure Schedule3 hours @ 140°CDesigned to be used with packages which are affected by higher levels of stress.
This cure will give optimumproperties.Curing below 125°C is not recommended. The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, swell as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion , ppm/°C:Below Tag (40 to 120°C) 40Glass Transition Temperature (Tag), °C 125StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 °C.
EO1061設計用于通過1000小時的溫度/濕度/偏壓測試和熱循環至125°C。在25°C下出色的粘度穩定性使用傳統的時間/壓力更容易控制噴丸尺寸分配設 |
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