ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
G757HF photocurable adhesive is designed for highthroughput assembly operations.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Density , g/cm3 1.15
Sag Resistance (45o angle), mm:
@ 25oC 1.88
@ 150oC 3.1
Shelf Life @ 0°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
45 minutes @ 140°C
20 minutes @ 160°C or
10 minutes @ 180°C or
Post Cure
2 to 4 hours at the highest expected use temperature
This product generates high heat during cure. No adverse exothermeffects are obtained when cured in bond thicknesses less than orabout 0.125 inches (3.2 mm).The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 0°C. Storage greater than or below 0°Ccan adversely affect product properties.
G757HF可光固化粘合劑專為高吞吐量組裝操作。
固化材料的典型特性
密度，g /cm31.15
阻力（45o角），mm：
@25oC1.88
@150oC3.1
保質(zhì)期0°C，月6
閃點(diǎn) - 參見(jiàn)MSDS
典型的固化性能
治愈時(shí)間表
在140°C 45分鐘
在160°C或20分鐘
180°C或10分鐘
后治
在*高預(yù)期使用溫度下2至4小時(shí)本產(chǎn)品在固化過(guò)程中產(chǎn)生高熱量。沒(méi)有不利的放熱當(dāng)焊接厚度小于或等于或小于固化時(shí)，可獲得效果約0.125英寸（3.2mm）。以上治療方案是準(zhǔn)則建議。治愈條件（時(shí)間和溫度）可能會(huì)根據(jù)客戶的經(jīng)驗(yàn)及其應(yīng)用要求，以及客戶固化設(shè)備， |
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