CM-S301主要由各種助劑如高分子、活性劑等組成，特別適用于碳化硼、氧化鋁和金剛石研磨液的懸浮，具有穩定性和分散性良好，去除率高、表面粗糙度小以及對工件無損傷等優點。即使在稀釋倍率很高的情況下使用，仍具有很好的研磨效率和使用壽命。
CM-S301 is mainly composed of some kinds of additives such as polymer, active agent and so on, which facilitate to suspend of boron carbide , aluminium oxide and diamond polishing agent. It has excellent particle stability, dispersal, and possesses a high removal rate, good surface effects and damage-free polishing. Even when used at high dilutions, still has excellent processing efficiency and long slurry life.
項目 Item
外觀 Appearance 膠體colloid
顏色 Colour 淺色 tint
pH (20℃) 11.0±0.5
比重 Specific gravity (20℃) 1.25±0.05
粘度 Viscosity (20℃，cps) ≥10
殺菌劑含量 Biocide Content (ppm) <500
用途 Application 研磨拋光 lapping and polishing
包裝 Package 25kg
符合RoHS標準 RoHS compliant |
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