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ABLEFILM® ECF561E electrically conductive die attachadhesive is designed for bonding materials with severelymismatched coefficients of thermal expansion. When used forsubstrate attach, this adhesive film acts as an electrical groundplane.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Shelf Life @ -40°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 150°C
Alternative Cure Schedule
2 hours @ 125°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C orgreater than minus (-)40 °C can adversely affect productproperties.
ABLEFILM®ECF561E導(dǎo)電芯片附件粘合劑設(shè)計(jì)用于嚴(yán)格粘接材料不匹配的熱膨脹系數(shù)。用于襯底附著,合膜用作電接地飛機(jī)
固化材料的典型特性
保質(zhì)期@ -40°C(從制造日期),第1年
典型的固化性能
治愈時(shí)間表
150℃下1小時(shí)
替代治療計(jì)劃
125°C下2小時(shí)
以上治療方案是指導(dǎo)性建議。治愈條件(時(shí)間和溫度)可能會(huì)根據(jù)客戶(hù)的經(jīng)驗(yàn)及其應(yīng)用要求,以及客戶(hù)
固化設(shè)備,烤箱加載和實(shí)際烤箱溫度。
存儲(chǔ)
將產(chǎn)品存放在未開(kāi)封的容器中,干燥處。存儲(chǔ)信息可能會(huì)在產(chǎn)品容器上顯示標(biāo)簽。*佳存儲(chǔ)溫度:-40°C。儲(chǔ)存溫度低于( - )40°C或大于( - )40°C會(huì)對(duì)產(chǎn)品產(chǎn)生不利影響屬性。 |
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