漢高漢高樂泰樂泰 貼片紅膠Chipbond 3611
技術服務熱線：021-51693135 / 021-22818476
樂泰 3611
樂泰 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.3
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
125 to 400LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
20 to 50
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength eveloped with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
樂泰 3611
樂泰 3611是表面安裝器件接designed for prior to to印制電路板波焊錫。特別是，很快治愈suited是需要高速貼片線。在非常低的吸濕allows longer exposure to濕度在開放浴池，不影響dispensability金造成無效訓練in the固化膠粘劑。
uncured材料的典型性能
比重：25℃1.3
屈服點，25℃，PA
平錐與血流計：
Haake PK 100，M10 / PK 1 2°錐
400lms 125 to
卡森粘度”25°C，pa∙s
平錐與血流計：
Haake PK 100，M10 / PK 1 2°錐
20至50
See SDS閃光點
典型的固化性能
推薦固化are exposure to熱條件（通常在100℃90-120二@ 150°C）。*終會治愈率和強度取決于我們住宅time at the固化溫度。
康復速度和時間，溫度
以下圖表顯示the rate of扭矩強度發展與時間在不同的溫度。 |
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