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技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂泰 3128 is a one part, heat curable epoxy. This product is
designed to cure at low temperature and gives excellent adhesion on a
wide range of materials in considerably short time. Typical applications
include Memory cards, CCD/CMOS Assemblies. Particularly suited
where low curing temperatures are required for heat sensitive
components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.6
Yield Point, 25 °C, mPa•s
Cone & Plate Rheometer
44,000
Casson Viscosity @ 25 °C, mPa•s (cP)
Cone & Plate Rheometer
7,000 to 27,000LMS
Pot life @ 25 °C, weeks 3
Shelf Life @ -25 to -15 °C, days 365
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
20 minutes @ 80 °C bondline temperature
60 minutes @ 60 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to
reach the desired cure temperature. Curing profiles should be
developed for each device. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: -15 °C to -25 °C. Storage below minus (-)25 °C
or greater than minus (-)15 °C can adversely affect product
properties
樂泰 3128是熱固化環(huán)氧樹脂的一部分。這個(gè)產(chǎn)品是
設(shè)計(jì)用于在低溫下固化并且在a上具有優(yōu)異的附著力
廣泛的材料在相當(dāng)短的時(shí)間內(nèi)。典型應(yīng)用
包括存儲(chǔ)卡，CCD / CMOS組件。特別適合
其中熱敏感需要較低的固化溫度
組件。
固化材料的典型特性
25°C時(shí)的比重1.6
產(chǎn)量點(diǎn)，25℃，mPa•s
錐板流變儀
44,000
卡松粘度@ 25℃，mPa•s（cP）
錐板流變 |
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