ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND G909 is designed for very high strength structuralbonding especially for dissimilar substrates that will beexposed to a wide range of operating temperatures.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity 1.15
Press Flow, seconds 65
Sag Resistance, mm 12.7
Shelf Life @ 0 to 4°C (from date of manufacture), months 4.5
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
90 minutes @ 100°C or
30 minutes @ 120°C or
20 minutes @ 150°C
Post Cure
2 to 4 hours at the highest expected use temperature
Cure schedules are "the time at cure temperature to achieve fullproduct cure". The times does not include the time required toramp-up to cure temperature.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 4°C. Storage greater than or below 4°Ccan adversely affect product properties. ECCOBOND G909設計用于非常高強度的結構特別適用于將要使用的不同基材暴露于廣泛的工作溫度。
固化材料的典型特性
比重1.15
按流，秒65
阻力，mm 12.7
保質期為0至4°C（從制造 |
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