樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/工業膠水/電子組裝膠水/工業用膠
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樂泰 384 is a thermally conductive adhesive systemdesigned for bonding heat generating components to heat sinks.
The high thermal conductivity provides excellent heatdissipation for thermally sensitive components, while thecontrolled strength permits field and service repair.
In high potapplications this product should be limited to a maximum of500 volts. Typical applications include bonding transformers,transistors and other heat generating electronic components toprinted circuit board assemblies or heat sinks.
TYPICAL PROPERTIES OF UNCURED MATERIALSpecific Gravity @ 25 °C 1.64Flash Point - See SDSViscosity, Brookfield - HBT, 25 °C, mPa•s (cP):
Spindle TE, speed 2.5 rpm, , Helipath 500,000 to 2,250,000LMSSpindle TE, speed 20 rpm, Helipath 300,000 to 800,000LMSTYPICAL PROPERTIES OF CURED MATERIALPhysical PropertiesCoefficient of Thermal Expansion,ISO 11359-2, K-169×10-6Coefficient of Thermal Conductivity, ISO 8302,W/(m•K)0.757Elongation, at break, ISO 527-3, % 0.9Tensile Strength, at break, ISO 527-3 N/mm2 13(psi) (1,800)Young's Modulus N/mm2 2,800 (psi) (400,000)Electrical PropertiesVolume Resistivity, IEC 60093, Ω•cm 1.3×1012Surface Resistivity, IEC 60093, Ω 5.1×1013Dielectric Breakdown Strength, IEC 60243-1, kV/mm 26.7Dielectric Constant / Dissipation Factor, IEC 60250:100-Hz 6.48 / 0.11-kHz 5.86 / 0.041-MHz 5.22 / 0.03 StorageStore product in the unopened container in a dry location.
樂泰 384是一種熱傳導粘合劑系統，用于將發熱部件粘合到加熱中水槽高導熱性為熱敏元件提供出色的散熱性，而受控的強度允許現場和維修。
在高應用中， |
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