HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/HYSOL ES1901電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
HYSOL®ES1901™ is a fast-setting, toughened, mediumviscosity,industrial grade epoxy adhesive.
Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bond line with excellent peel resistance.
When fully cured, the epoxy is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator.
HYSOL®ES1901™ is ideal for bonding plastic, metal, glass, wood, ceramic, rubber, and masonry materials where flexibility is needed.
Designed for a variety of applications such as flex circuits, cable boots, and staking fillet bonds.
This material is well suited for applications that require an ultraclean bondline.
TYPICAL PROPERTIES OF UNCURED MATERIAL Part A Properties Specific Gravity @ 25oC 1.1Viscosity @ oC, cps 1,900Flash Point, oC >93Part B Properties Specific Gravity @ 25oC 1.15Viscosity @ oC, cps 2,800Flash Point, oC >93Mixed Properties Specific Gravity @ 25oC 1.13Viscosity @ 25oC, cPs 2,400Gel Time, 50 gm mass @ 25 °C, minutes 3Tack free time, minutes 3.5 to 4Recommended Curing Conditions24 hours @ 25 °C (Recommended cure)TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties: Shore Hardness , Udometer D 55Glass Transition Temperature, °C 10Tensile Strength, psi 270Tensile Elongation, % 80StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerabeling.
Optimal Storage: 20 °C to 30 °C. Storage below 20 °C or greater than 30 °C can adversely affect product properties.
HYSOL®ES1901™是一種快速固化，中等粘度，工業(yè)級環(huán)氧膠粘劑。
一旦混合，雙組分環(huán)氧樹脂在室溫下固化，收縮率低，形成超透 |
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